FA Roadmap Session

FA Technology Roadmap 

The purpose of the FA Technology Roadmap is to leverage the technical expertise captured throughout the industry to identify both current and future FA challenges as part of an annual industry-wide gap analysis. To have this effort formalized and available across the industry in an interactive and inclusive manner will not only return a critical compilation of relevant action items it will also serve as a recognized technical platform from which future failure analysts will benefit. In addition, its purpose is to serve as a technical platform from which everyone connected to the industry can learn, interact, and prepare for the future.

Following ISTFA 2022's comprehensive presentation of FA Roadmap Gaps by individual councils (summary attached), ISTFA 2024 will spotlight vendor solutions to identified gaps. This will help to get direct feedback from equipment providers, seeking their perspectives on addressing identified gaps and potential technological solutions. This collaborative approach aims to create a clear mapping between industry challenges and available or upcoming solutions, while fostering stronger partnerships between vendors and FA labs.

Agenda:

•  FA Roadmap Overview
•  Vendor Sharing Session on Solutions to identified Gaps
•  CHIPS SBIR Funding Awardees Sharing
•  FA Roadmap Poll survey on App
•  Audience Q&A

FA Roadmap Gap Slides: https://www.asminternational.org/istfa-2024/wp-content/uploads/sites/58/2024/10/FA-Roadmap_Gaps_Summary_ISTFA_App.pdf 

More Information: FA Technology Roadmap Committee | Electronic Device Failure Analysis Society Vinod Narang, Advanced Micro Devices (S) Pte Ltd and Dr. Keith Serrels, NXP Semiconductors