Invited Talk: Dr. Zhi Yang, Groq, presents, “AI-Driven Packaging Design: Accelerating Reliability through Smart Data Integration and Optimization”.
Title: “AI-Driven Packaging Design: Accelerating Reliability through Smart Data Integration and Optimization”
Abstract:
In High-Performance Computing (HPC) and Artificial Intelligence (AI) packaging design, achieving an optimal balance across thermal, mechanical, electrical, and manufacturability domains is essential for ensuring device reliability. Traditional testing methods are resource-intensive, with long feedback loops, while digital twins, though useful for prediction, often suffer from limited fidelity and physics constraints.
AI is revolutionizing packaging design by bridging this gap. By integrating high-fidelity test data with lower-fidelity digital twin models, machine learning algorithms can identify critical patterns and correlations that traditional methods may overlook. This enables more accurate and efficient design optimization, reducing reliance on costly physical testing.
Furthermore, AI enhances cross-domain integration, facilitating the selection of high-impact Design of Experiments (DOE) to target the most critical design factors. This approach accelerates development cycles, reduces prototyping, and leads to more reliable packaging solutions.
By incorporating AI across the design process, engineers can significantly improve the precision, efficiency, and overall reliability of packaging designs, driving advancements in failure analysis and setting the stage for next-generation electronics.
Biography:
Zhi Yang is Sr. Dir of Packaging at Groq. He leads the team ensuring hardware success of packages from all aspects. Outside Groq, he serves as committee members for multiple prestigious conferences and editors for several thermal/ packaging journals. Zhi has over 40 publications on thermal management and packaging fields with 6000+ citations.
Mr. Kent Erington, Advanced Micro Devices and Dr. Mike Bruce, Independant