Invited Talk: Mike Campbell, Qualcomm, presents, "Starting a Lab from Scratch"
- Discusses evolution of failure analysis over different technology nodes.
- Highlights challenges and solutions in finding defects.
- Covers advanced FA workflows from the 1990s to 2020s.
- Emphasizes the need for AI/ML to reshape FA processes.
- Identifies key industry challenges and proposed solutions.
- Calls for industry collaboration to face future challenges.
Biography:
Michael Campbell is Senior Vice President of Engineering for QUALCOMM CDMA Technologies, responsible for QCT Product and Test, Test Automation, Failure Analysis and yield. Mike joined QCT in 1996. Michael’s first job at Qualcomm was to start the FA department for Qualcomm and since then Michael has led multiple teams including, Design Automation, Yield optimization, Product & Test Engineering, Foundry semiconductor analysis and Quality,
While at Qualcomm, Michael also has brought up Design and Test facilities in Bangalore, Singapore, Taiwan and Mexico. In his current role, he is working to transform PTE , FA and semiconductor development by driving machine learning (AI)using data available from semiconductor test to train models and automate processes.
Prior to joining QUALCOMM, Michael was with other companies, including Mostek, INMOS and Honeywell. He holds a BSEE & CE from Clarkson University. Ms. Lesly Endrinal, Google LLC