Invited Talk - Steven Herschbein, presents, "The CHIPS Act and its Impact on the Semiconductor Industry and Analytical Labs".
Retired, Independent Consultant
Former IBM & Globalfoundries FA Team Leader
Title: “The CHIPS Act and its Impact on the Semiconductor Industry and Analytical Labs”
Abstract:
Large sectors of the semiconductor industry were a drag on the worldwide economic recovery after COVID. Was it just complex post-pandemic restart issues, or indicative of far greater problems? And even as it did recover, North American contribution to worldwide production resumed a sub 15% position, an all-time low. In the US, some States came to recognize the growing problems and began to respond. Eventually the US Government took action (the CHIPS Act). But not long after, so did at least 5 other agencies worldwide, setting off a new-age gold rush with nearly $300B in play. Where is that money being spent? How will it impact manufacturing and process development? Will some of it be used to address highlighted deficiencies in the area of Analytical/FA gaps that threaten to hinder semiconductor advancement? In this talk we’ll take a look at a number of troubling indicators in the years prior to 2020 that played into the issues and slow recovery, and how the new infusion of money is changing the outlook.
Biography:
Steve claims to be retired after 45 years in Microelectronics, but still dabbles as an independent consultant. He remains an active member of EDFAS, committed to the development of next generation analytical laboratory tooling to keep pace with evolving semiconductor process technology. In this role he has addressed the CHIPS for America R&D Program Office on the need for funding models that actively support new FA methodologies, equipment and education. Prior to 2021 he served as the Focused Ion Beam (FIB) Chip Circuit Edit team leader at GlobalFoundries and IBM Microelectronics, and has been heavily involved in FIB tooling, applications & development for over 25 years. Before venturing into FIB, he worked in wafer fab processing, chip & package reliability, and electrical and physical FA at IBM, Harris Semiconductor, MOSTEK & Fairchild Semiconductor. In addition to Lab oriented activity, Steve was an early industry player in the effort to bring FIB technology into the 300mm fab line for defect review, process monitoring and metrology applications. Steve holds a BS in Electrical Engineering from Clarkson University, Potsdam, NY. He has 12 US Patents, presented 17 ASM & IEEE juried symposium papers, and 20+ FIB tutorials and general technology conference lectures.
Mr. Greg Johnson, Zeiss Microscopy