Failure Analysis Challenges for Chip Scale Packages
Failure Analysis Challenges for Chip Scale Packages
Sunday, November 16, 2025: 9:00 AM
2 (Pasadena Convention Center)
Summary:
In this tutorial, an overview of CSPs, including the development of Wafer Level CSP (WLCSP), and 2.5D and 3D SiP packages, will be provided. Some failure analysis challenges, including sample preparation, non-destructive imaging, and fault isolation precision at both package level and die level, will be discussed. Finally, some solutions and best practices will be shared on how to overcome some of the challenges. At the end, two case studies will be presented to demonstrate how successful failure analysis work can be accomplished on CSP devices.
In this tutorial, an overview of CSPs, including the development of Wafer Level CSP (WLCSP), and 2.5D and 3D SiP packages, will be provided. Some failure analysis challenges, including sample preparation, non-destructive imaging, and fault isolation precision at both package level and die level, will be discussed. Finally, some solutions and best practices will be shared on how to overcome some of the challenges. At the end, two case studies will be presented to demonstrate how successful failure analysis work can be accomplished on CSP devices.