51st International Symposium for Testing and Failure Analysis (November 16-20, 2025): At-A-Glance
51st International Symposium for Testing and Failure Analysis (November 16-20, 2025): At-A-Glance
SUNDAY November 16
Networking
AM
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Refreshment Break10:00 AM-10:20 AM
PM
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Lunch12:20 PM-1:30 PM
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Refreshment Break3:30 PM-3:50 PM
Tutorial
AM
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Microscopy - TEM8:00 AM-9:00 AM
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Package and Physical Analysis - Flip Chip8:00 AM-9:00 AM
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Tech. Specific & Featured - Machine Learning8:00 AM-9:00 AM
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Microscopy - TEM Sample Prep9:00 AM-10:00 AM
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Package and Physical Analysis - Chip Scale9:00 AM-10:00 AM
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Tech. Specific & Featured - SRAM9:00 AM-10:00 AM
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Fault Isolation - CSAM I10:20 AM-11:20 AM
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Microscopy - SEM Basics10:20 AM-11:20 AM
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Tech. Specific & Featured - Lab Construction10:20 AM-11:20 AM
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Fault Isolation - Lock-in Thermography11:20 AM-12:20 PM
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Microscopy - TEM Imag w/SEM Diffraction11:20 AM-12:20 PM
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Tech. Specific & Featured - Intro to FIB11:20 AM-12:20 PM
PM
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Electrical & Yield - Nanoprobe1:30 PM-2:30 PM
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Fault Isolation - CSAM II1:30 PM-2:30 PM
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Microscopy - SEM Sample Prep1:30 PM-2:30 PM
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Electrical & Yield - MOSFET Testing2:30 PM-3:30 PM
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Microscopy - FIB Sample Prep2:30 PM-3:30 PM
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Tech. Specific & Featured - Analog Sim2:30 PM-3:30 PM
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Electrical & Yield - Yield Basics3:50 PM-4:50 PM
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Microscopy - AFM in SEM3:50 PM-4:50 PM
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Fault Isolation - LADA/SDL3:50 PM-5:20 PM
MONDAY November 17
Networking
AM
-
Refreshment Break10:00 AM-10:20 AM
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Break11:20 AM-11:30 AM
PM
-
Refreshment Break2:40 PM-3:00 PM
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Expo - Tools of the Trade Tour5:00 PM-6:30 PM
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Social Event6:30 PM-9:30 PM
Technical Program
AM
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Emerging FA Techniques and Concepts I10:20 AM-11:00 AM
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FIB Sample Preparation I10:20 AM-11:20 AM
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Package Level Fault Isolation10:20 AM-11:20 AM
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Emerging FA Techniques and Concepts II11:30 AM-12:10 PM
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FIB Sample Preparation II11:30 AM-12:10 PM
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Scanning Probe Analysis11:30 AM-12:10 PM
PM
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FIB User Group Discussion & Lunch12:10 PM-1:40 PM
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Nanoprobing / SPM User Group Discussion & Lunch12:10 PM-1:40 PM
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FIB Sample Preparation III1:40 PM-2:40 PM
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Microscopy Analysis and Material Characterization I1:40 PM-2:40 PM
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FIB Sample Preparation IV3:00 PM-4:00 PM
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Microscopy Analysis and Material Characterization II3:00 PM-4:00 PM
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FIB Circuit Analysis & Edit4:00 PM-4:40 PM
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Product Yield, Test and Diagnostics4:00 PM-5:00 PM
Tutorial
PM
-
Fault Isolation - Diag SoC3:00 PM-4:30 PM
TUESDAY November 18
Networking
AM
-
Expo Break9:30 AM-10:00 AM
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Exhibit Open Hours9:30 AM-6:30 PM
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Expo Floor Lunch11:50 AM-12:50 PM
PM
-
Expo Refreshment Break2:50 PM-3:20 PM
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Welcome Reception with Exhibitors4:30 PM-6:00 PM
Technical Program
AM
-
Chips Act Update10:00 AM-10:30 AM
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AI Applications for Failure Analysis I10:30 AM-11:50 AM
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Device Analysis - Case Studies I10:30 AM-11:50 AM
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FA Process: Fault Isolation, Mechanisms, & Solutions I10:30 AM-11:50 AM
PM
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FA Process: Fault Isolation, Mechanisms, & Solutions II12:50 PM-1:30 PM
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Device Analysis - Case Studies II12:50 PM-2:10 PM
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AI Applications for Failure Analysis II12:50 PM-2:50 PM
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Nanoprobing & Electrical Characterization I1:30 PM-2:30 PM
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The Capital Equipment Buying Journey in FA Labs2:10 PM-2:30 PM
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Nanoprobing & Electrical Characterization II3:20 PM-4:20 PM
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AI User Group Discussion3:20 PM-4:50 PM
Tutorial
PM
-
Microscopy - Charged Particle3:20 PM-4:20 PM
WEDNESDAY November 19
Networking
AM
-
Refreshment Break9:00 AM-9:30 AM
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Exhibit Open Hours9:00 AM-4:00 PM
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Expo Break11:20 AM-11:40 AM
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Lunch11:50 AM-1:20 PM
PM
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Expo Break1:10 PM-1:30 PM
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Dessert Reception & Poster Session3:00 PM-4:00 PM
Poster Session
PM
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Poster Session3:00 PM-4:00 PM
Student Poster Contest
PM
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Student Poster Session3:00 PM-4:00 PM
Technical Program
AM
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Power Devices (Si, SiC, GaN)8:00 AM-9:00 AM
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SIP User Group Discussion9:00 AM-10:30 AM
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IRFA Keynote Speaker - Dr. Shida Tan10:30 AM-11:30 AM
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Women in Failure Analysis Session & Lunch11:50 AM-1:20 PM
PM
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Panel Discussion1:30 PM-3:00 PM
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Expo Floor - Poster Session3:00 PM-4:00 PM
Tutorial
AM
-
Microscopy - Atomic Probe Tomography8:00 AM-9:00 AM
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Microscopy - STEM EBIC8:00 AM-9:00 AM
Video Contest
PM
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Video Contest3:00 PM-4:00 PM
THURSDAY November 20
Networking
AM
-
Refreshment Break9:40 AM-10:00 AM
Technical Program
AM
-
Boards and System Level FA8:00 AM-8:40 AM
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Die Level Fault Isolation I8:40 AM-9:40 AM
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Die Level Fault Isolation II10:00 AM-11:00 AM
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Sample Preparation and Device De-processing I10:00 AM-11:00 AM
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OFI User Group Discussion & Lunch11:20 AM-12:50 PM
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Sample Prep User Group Discussion & Lunch11:20 AM-12:50 PM
PM
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Sample Preparation and Device De-processing II12:50 PM-1:30 PM
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Hardware Security and Counterfeiting12:50 PM-2:10 PM
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System in Package and 3D Devices1:30 PM-2:10 PM
Tutorial
AM
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Microscopy - Spectrometers8:40 AM-9:40 AM