Emerging FA Techniques and Concepts - Open Failure LiT Localization Using Radio Frequency and Amplitude Modulation
Emerging FA Techniques and Concepts - Open Failure LiT Localization Using Radio Frequency and Amplitude Modulation
Wednesday, November 19, 2025
Summary:
Open failures are among the most challenging issues encountered in failure analysis (FA) due to their elusive nature and difficulty in pinpointing their root causes. The LiT using RF and AM stimulus trigger technique was introduced during the 2023 and 2024 ISTFA conference, since then we have made improvements with additional experiments and discoveries. This paper explores the complexities of open failure analysis, discussing the common causes, tools, and methodologies used in the investigation of such failures. We examine the challenges faced and highlight the importance of High Frequency/Amplitude Modulation Lock-in Thermal fault isolation technique, the effect of secondary harmonics because of over stimulus and conclusion made from Frequency/Amplitude variation. Through case studies and practical examples, we demonstrate how open failures can be systematically and successfully fault isolated in both board and die level. The paper aims to provide a comprehensive understanding of open failures in FA, emphasizing the importance of meticulous analysis in fault isolating these hard-to-trace faults.
Open failures are among the most challenging issues encountered in failure analysis (FA) due to their elusive nature and difficulty in pinpointing their root causes. The LiT using RF and AM stimulus trigger technique was introduced during the 2023 and 2024 ISTFA conference, since then we have made improvements with additional experiments and discoveries. This paper explores the complexities of open failure analysis, discussing the common causes, tools, and methodologies used in the investigation of such failures. We examine the challenges faced and highlight the importance of High Frequency/Amplitude Modulation Lock-in Thermal fault isolation technique, the effect of secondary harmonics because of over stimulus and conclusion made from Frequency/Amplitude variation. Through case studies and practical examples, we demonstrate how open failures can be systematically and successfully fault isolated in both board and die level. The paper aims to provide a comprehensive understanding of open failures in FA, emphasizing the importance of meticulous analysis in fault isolating these hard-to-trace faults.