Product Yield, Test and Diagnostics - Iterative approach LVI-based for devices with single scan chain architecture
Product Yield, Test and Diagnostics - Iterative approach LVI-based for devices with single scan chain architecture
Wednesday, November 19, 2025
Summary:
The aim of this paper is to present an alternative failure analysis (FA) approach to address complex cases involving digital failures in a device with a single scan chain structure. The software diagnostic methodologies for scan chain rejects presents some limitations and inefficiencies due to the lack of interaction between the chains. The objective of the study is to improve the methodology by Fault Isolation using mainly the Laser Voltage Imaging (LVI) and Laser Voltage Probing (LVP) technique. This approach allows the identification of the failure point in a unique manner.
The aim of this paper is to present an alternative failure analysis (FA) approach to address complex cases involving digital failures in a device with a single scan chain structure. The software diagnostic methodologies for scan chain rejects presents some limitations and inefficiencies due to the lack of interaction between the chains. The objective of the study is to improve the methodology by Fault Isolation using mainly the Laser Voltage Imaging (LVI) and Laser Voltage Probing (LVP) technique. This approach allows the identification of the failure point in a unique manner.