Die Level Fault Isolation - Failure Analysis of a 2nm device with BSPDN Architecture Using an Electron Beam Probing

Wednesday, November 19, 2025

Exhibit Hall A&B (Pasadena Convention Center)

Mr. Yin Lung Ke , TSMC, Hsinchu, Taiwan, Taiwan

Mr. Samson Tsai , Thermofisher Sicentific, Hsinchu, TAIWAN, Taiwan

Mr. J.H. Lin , TSMC, Hsinchu, Taiwan, Taiwan

Summary:

the title changed the process name from 2nm to A16

See more of: Poster Session
See more of: Poster Session