Die Level Fault Isolation - Failure Analysis of a 2nm device with BSPDN Architecture Using an Electron Beam Probing

Wednesday, November 19, 2025
Mr. Yin Lung Ke , TSMC, Hsinchu, Taiwan, Taiwan
Mr. Samson Tsai , Thermofisher Sicentific, Hsinchu, Taiwan
Mr. J.H. Lin , TSMC, Hsinchu, Taiwan, Taiwan

Summary:

the title changed the process name from 2nm to A16
See more of: Poster Session
See more of: Poster Session