More Than Moore - Reliability Testing and Failure Analysis of Silicon Photonics with 60GHz for 200G/lane under Thermal and Humidity Stress
More Than Moore - Reliability Testing and Failure Analysis of Silicon Photonics with 60GHz for 200G/lane under Thermal and Humidity Stress
Wednesday, November 19, 2025
Summary:
As data centers rapidly evolve, the demand for high-speed, energy-efficient optical communication solutions has propelled the rise of silicon photonics. This study investigates the reliability of silicon photonic integrated circuits (PICs) designed for 200G/lane data rates under severe thermal and humidity stress conditions. Through systematic thermal cycling (TCT) and highly accelerated stress testing (uHAST), the bare dies exhibited excellent stability, with minimal electrical variation and projected lifespans exceeding 15 years under typical conditions. Even under harsher uHAST environments (55°C, 60% RH), the devices maintained robust performance, demonstrating an estimated operational lifetime of 6 years. However, when integrated into complex 3D packages with multiplexers, laser drivers, and EML lasers, increased thermal stress on interconnect bumps presents a key reliability challenge. This research offers crucial insights into the qualification of silicon photonics for next-generation high-speed interconnects.
As data centers rapidly evolve, the demand for high-speed, energy-efficient optical communication solutions has propelled the rise of silicon photonics. This study investigates the reliability of silicon photonic integrated circuits (PICs) designed for 200G/lane data rates under severe thermal and humidity stress conditions. Through systematic thermal cycling (TCT) and highly accelerated stress testing (uHAST), the bare dies exhibited excellent stability, with minimal electrical variation and projected lifespans exceeding 15 years under typical conditions. Even under harsher uHAST environments (55°C, 60% RH), the devices maintained robust performance, demonstrating an estimated operational lifetime of 6 years. However, when integrated into complex 3D packages with multiplexers, laser drivers, and EML lasers, increased thermal stress on interconnect bumps presents a key reliability challenge. This research offers crucial insights into the qualification of silicon photonics for next-generation high-speed interconnects.