Microscopy Analysis and Material Characterization - Thermoreflectance microscopy for the steady-state and transient thermal analysis of semiconductor devices
Microscopy Analysis and Material Characterization - Thermoreflectance microscopy for the steady-state and transient thermal analysis of semiconductor devices
Wednesday, November 19, 2025
Summary:
We present a high-sensitive, dual-mode thermoreflectance microscopy (TRM) system for analyzing steady-state and transient thermal phenomena in semiconductor devices. The system employs visible microscope integrated with tunable bandpass filters and a white LED to identify optimal probing wavelengths, enhancing thermal sensitivity. Thermal imaging is achieved using a four-bucket themroreflectance method for steady-state and pulsed boxcar averaging for transient analysis, enabling 200 ns temporal resolution and sub-micron spatial resolution. Demonstrations on a polycrystalline silicon microresistor validate the system's capability to visualize self-heating and heat diffusion, making it a promising tool for advanced thermal analysis and failure analysis of semiconductor devices.
We present a high-sensitive, dual-mode thermoreflectance microscopy (TRM) system for analyzing steady-state and transient thermal phenomena in semiconductor devices. The system employs visible microscope integrated with tunable bandpass filters and a white LED to identify optimal probing wavelengths, enhancing thermal sensitivity. Thermal imaging is achieved using a four-bucket themroreflectance method for steady-state and pulsed boxcar averaging for transient analysis, enabling 200 ns temporal resolution and sub-micron spatial resolution. Demonstrations on a polycrystalline silicon microresistor validate the system's capability to visualize self-heating and heat diffusion, making it a promising tool for advanced thermal analysis and failure analysis of semiconductor devices.