Effective Fault Isolation Beyond 2nm Programmable Logic by Dynamic ELITE
Effective Fault Isolation Beyond 2nm Programmable Logic by Dynamic ELITE
Thursday, November 20, 2025: 9:00 AM
1 (Pasadena Convention Center)
Summary:
This paper will present a complete fault isolation (FI) and physical failure analysis (PFA) flow on advanced backside power delivery silicon technology. In FI, it demonstrates the effectiveness of dynamic ELITE in isolating functional failure in 2nm process on the programmable logic subsystem. Using the customized test pattern and direct tester docking mechanism, ELITE camera is capable in detecting the heat propagated from transistors through lock-in environment. This effort also highlights the novel de-processing method through backside power delivery metal stack to access the active diffusion layer through backside diffusion via.
This paper will present a complete fault isolation (FI) and physical failure analysis (PFA) flow on advanced backside power delivery silicon technology. In FI, it demonstrates the effectiveness of dynamic ELITE in isolating functional failure in 2nm process on the programmable logic subsystem. Using the customized test pattern and direct tester docking mechanism, ELITE camera is capable in detecting the heat propagated from transistors through lock-in environment. This effort also highlights the novel de-processing method through backside power delivery metal stack to access the active diffusion layer through backside diffusion via.