Package Level Fault Isolation - Embedded Deep Trench Capacitor (DTC) Failure Analysis Methodolgy

Wednesday, November 19, 2025
Mr. Hu hao , Qualcomm, Singapore, Singapore, Singapore
Mr. kan sun , Qualcomm, Singapore, Singapore
Mr. Cheng Hoe lee , Qualcomm, Singapore, Singapore
Mr. Chua Tze ping , Qualcomm, Singapore, Singapore
Mrs. Lim Jye Pine , Qualcomm, Singapore, Singapore, Singapore

Summary:

Analyzing failures in deep trench capacitor (DTC) presents significant challenges, particularly in terms of electrical fault isolation and physical failure analysis. This paper explores these challenges and outlines the methodologies employed to address failures related to DTC
See more of: Poster Session
See more of: Poster Session