Dr. Guillaume Fiannaca

Failure Analysis Manager
EM Microelectronics
Marin-Epagnier, .
Switzerland 2074

Papers:

Advanced method for 3D FIB tomography AI supported on SRAM I/O circuit block with missing data bits problems
First and Preliminary Approach at the Usage of FIB ToF for Borophosphilicate Layer Characterization Directly on Device Failing Structures