Package and Physical Analysis - Flip Chip

Sunday, November 16, 2025: 8:00 AM-9:00 AM
2 (Pasadena Convention Center)
8:00 AM
Flip Chip and Backside Techniques
Dr. Edward I. Cole Jr., FASM, Sandia National Laboratories; Kira L. Fishgrab, Sandia National Laboratories; Dr. Daniel L. Barton, Sandia National Laboratories; Dr. Karoline Bernhard-Hofer, Infineon
See more of: Tutorial
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