Panel Discussion: Scaling Beyond Moore’s Law: Heterogeneous Computing and Advanced Packaging

Wednesday, November 19, 2025: 1:30 PM-3:00 PM
Exhibit Hall A&B - Industry Exchange (Pasadena Convention Center)
We are excited to invite you to join the ISTFA 2025 panel discussion, where four FA experts and industry leaders will share knowledge and foster brainstorming on the evolving challenges in the FA lab. With the ever-increasing demand on computing brought on by AI and data centers, package design has introduced new technologies to maintain and improve Power, Performance, Area, and Cost (PPAC). Technologies such as Heterogeneous Computing are adding components with different designs, expected reliability, nodes, pitches, lifetimes, and materials of varying mechanical and thermal properties. This complexity presents unprecedented challenges in test, design verification, and technician training for handling these advanced packages. Your participation will enrich the discussion and help drive innovative solutions for our community. We encourage your questions and insights during the session to foster a sense of collaboration. Don’t miss this unique opportunity to engage with industry leaders and contribute your perspective.

Moderators:
Greg Johnson, Zeiss
Wentao Qin, Microchip Technology, Inc.

Panelists:
Professor Navid Asadi, University of Florida
Susan Li, Marvell Technology
Bernice Zee, AMD
Professor Boris Vaisband, University of California, Irvine

See more of: Technical Program
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