ISTFA Keynote Speaker: Dr. Liwei Wang, Senior Director of Heterogeneous Integration Foundry Technology Development, AMD

Tuesday, November 18, 2025: 8:30 AM-9:30 AM
Exhibit Hall A&B - Industry Exchange (Pasadena Convention Center)
Future of AI Hardware Enabled by Advanced Packaging

Chiplet architectures are fundamental to the continued economic viable growth of power efficiency of AI hardware and edge computing. The slowing of Moore’s law has also placed advanced packaging at the critical juncture of technology-architecture intersection driving unique product capabilities. New heterogeneous architectures like 2.5D architectures and 3D Hybrid bonded architectures driving AMD’s industry leading advanced technology roadmap to enable power, performance, area, and cost (PPAC) will be discussed. Other topics including Chiplets for AI, challenges and solutions for large chiplet modules etc. will also be discussed.

Biography: Liwei Wang, Sr Director, is currently leading the Heterogeneous Integration Foundry Technology Development team at AMD. Drive Foundry Based Advanced Packaging Technology development and deliver best-in-class yield and quality for AMD products across Data Center (CPU/GPU), Adaptive and Embedded Computing Group, and Client Group. The team also collaborates with the HB Technology Ecosystem to advance 3D stacking technology for future product needs. Prior to joining AMD, Liwei devoted 14 years at Intel, where she held various technical leadership roles in the advanced packaging definition and development of 2.5D (EMIB) and 3D (Foveros) technologies. Liwei holds a Ph.D. in Materials Science and Engineering from Auburn University. She currently resides in Austin, TX, with her husband and two girls. In her spare time, Liwei enjoys playing tennis and traveling with her family.
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