Sub-4 nm Device Diagnostics: A New Frontier in Fault Isolation through Atomic Force Microscopy
Sub-4 nm Device Diagnostics: A New Frontier in Fault Isolation through Atomic Force Microscopy
Tuesday, October 6, 2026: 3:40 PM
Summary:
Quality control in semiconductor manufacturing processes is essential for improving production efficiency and product reliability. In particular, defect detection plays a crucial role in identifying problematic factors at an early stage, thereby reducing costs and enhancing overall performance. Traditional defect detection techniques face limitations in high-resolution analysis and sensing fine electrical characteristics, highlighting the need for alternative approaches. Atomic Force Microscopy (AFM)-based Scanning Capacitance Microscopy (SCM) has emerged as a promising solution, offering precise measurement of the electrical properties of semiconductor surfaces and excelling in detecting subtle changes such as threshold voltage (Vth) flavor variations. Here, in this study, we aim to leverage these changes to detect semiconductor defects early, thereby enhancing the reliability of manufacturing processes. By doing so, it introduces a new paradigm in quality control for the semiconductor industry and explores opportunities to maximize efficiency.
Quality control in semiconductor manufacturing processes is essential for improving production efficiency and product reliability. In particular, defect detection plays a crucial role in identifying problematic factors at an early stage, thereby reducing costs and enhancing overall performance. Traditional defect detection techniques face limitations in high-resolution analysis and sensing fine electrical characteristics, highlighting the need for alternative approaches. Atomic Force Microscopy (AFM)-based Scanning Capacitance Microscopy (SCM) has emerged as a promising solution, offering precise measurement of the electrical properties of semiconductor surfaces and excelling in detecting subtle changes such as threshold voltage (Vth) flavor variations. Here, in this study, we aim to leverage these changes to detect semiconductor defects early, thereby enhancing the reliability of manufacturing processes. By doing so, it introduces a new paradigm in quality control for the semiconductor industry and explores opportunities to maximize efficiency.