A new paradigm to soft defect localization and speed path analysis through Laser Perturbation Probing
A new paradigm to soft defect localization and speed path analysis through Laser Perturbation Probing
Wednesday, October 7, 2026: 8:40 AM
Summary:
Soft defect localization (SDL) and speed path analysis techniques, such as Laser assisted device alteration (LADA), are widely used to investigate failures involving test margin shifts or inherent timing and voltage constraints due to design and process marginalities. However, these methods provide limited quantitative insight into the laser induced changes in timing or signal levels. In this work, we demonstrate for the first time the use of Laser Perturbation Probing to quantitatively analyze soft defects and critical speed paths, including differential laser voltage probing within a suspected defective cell. This approach offers clear advantages for characterizing marginal defects, particularly in advanced technology nodes with small geometries.
Soft defect localization (SDL) and speed path analysis techniques, such as Laser assisted device alteration (LADA), are widely used to investigate failures involving test margin shifts or inherent timing and voltage constraints due to design and process marginalities. However, these methods provide limited quantitative insight into the laser induced changes in timing or signal levels. In this work, we demonstrate for the first time the use of Laser Perturbation Probing to quantitatively analyze soft defects and critical speed paths, including differential laser voltage probing within a suspected defective cell. This approach offers clear advantages for characterizing marginal defects, particularly in advanced technology nodes with small geometries.