Studies of Galvanic Corrosion on Al Bondpads in Wafer Fabrication and Assembly Processes
Studies of Galvanic Corrosion on Al Bondpads in Wafer Fabrication and Assembly Processes
Wednesday, October 7, 2026: 10:20 PM
Summary:
In this paper, we will study the characteristics and failure mechanisms of galvanic corrosion. We will study and discuss the three key concerns/questions from wafer fabrication, assembly house and failure analysis engineering teams. After studies, we can understand that (A). galvanic corrosion is not a contamination-related problem, but it is two metal corrosion. (B). Galvanic corrosion originates in the wafer fabrication, but it will be enhanced during assembly processes, especially during wafer sawing process. (C). After performing failure analysis, we could easily distinguish and judge the obvious differences between defects that occur in wafer fabs and assembly house. Finally, we can understand more about galvanic corrosion on Al bondpads, and then help the engineering teams eliminate galvanic corrosion in wafer fab and assembly processes.
In this paper, we will study the characteristics and failure mechanisms of galvanic corrosion. We will study and discuss the three key concerns/questions from wafer fabrication, assembly house and failure analysis engineering teams. After studies, we can understand that (A). galvanic corrosion is not a contamination-related problem, but it is two metal corrosion. (B). Galvanic corrosion originates in the wafer fabrication, but it will be enhanced during assembly processes, especially during wafer sawing process. (C). After performing failure analysis, we could easily distinguish and judge the obvious differences between defects that occur in wafer fabs and assembly house. Finally, we can understand more about galvanic corrosion on Al bondpads, and then help the engineering teams eliminate galvanic corrosion in wafer fab and assembly processes.