Poster Session

3:00 PM

AI-Driven Super-Resolution Enhancement of SEM Images for Semiconductor Failure Analysis
Dr. Alexey Solovey, NVIDIA Corporation; Jonathon Elliott, NVIDIA Corporation; Chuan Zhang, NVIDIA Corporation; Jane Li, NVIDIA Corporation

3:20 PM

Failure Analysis Methodology for STT‑MRAM Bit Cells and Emerging Memories
Mr. Cheng-Piao Lin, MSSCORPS CO.,LTD

3:40 PM

EBAC signal enhancement with the studies on the phenomenon of ‘overloading’
Mr. LC SUN, SIEN (Qingdao) Integrated Circuit Co.; Ms. Hui Song, SIEN (Qingdao) Integrated Circuit Co.; Ms. LIANG ZHANG, SIEN (Qingdao) Integrated Circuit Co.

4:00 PM

A Direct Backside Approach Failure Analysis in High-Layer-Count 3D Flash Memory for High Resistance Failures
Mr. Zhung Ping Ooi, SanDisk Storage Malaysia Sdn. Bhd.; Ms. Bee Chin Loke, SanDisk Storage Malaysia Sdn. Bhd.; Mr. Aik Leng Tan, SanDisk Storage Malaysia Sdn. Bhd.; Mr. Mohd Asyraf Mohd Amir Hamzah, SanDisk Storage Malaysia Sdn. Bhd.; Mr. Chee Peng Lim, SanDisk Storage Malaysia Sdn. Bhd.; Lito De La Rama, Sandisk Technologies, Inc.

4:20 PM

Extensive Fault Isolation & Defect Localization of Subsurface Silicon Failures in TVS Devices
Mr. Sherwin Hassan, Semtech Corporation; Mr. Jeffrey S. Javier, Semtech Corporation

4:40 PM

OBIRCH Hotspot Detection via MH-to-WL Biasing for NAND-type 3D Flash Memory Hole Defect Isolation
Shengli Chen, SanDisk Information Technology (Shanghai) Co. Ltd.; Alex Su, SanDisk Information Technology (Shanghai) Co. Ltd.; Rita Hou, SanDisk Information Technology (Shanghai) Co. Ltd.

5:00 PM

Localization of Gate Oxide Defects in Pool Capacitors in NAND-type 3D Flash memory
Mimi Dang, Sandisk Technologies Inc; Xiaochen Zhu, Sandisk Technologies Inc; Ngo Long, Sandisk Technologies Inc; Phi Long, Sandisk Technologies Inc; Elliott Rill, Sandisk Technologies Inc; Lito De La Rama, Sandisk Technologies Inc

5:20 PM

Practical Interpretation of Die Crack Origin in Semiconductor Packages Using Multi-Mode Scanning Acoustic Microscopy with B-Scan and TAMI Analysis
Ms. Esther Lim Kean Poh, Infineon Technology Memory Solutions Malaysia Sdn. Bhd.

5:40 PM

Quantum Diamond Microscopy as a Non-Destructive Method for Short Localization in High‑Density 2.5D MIMCAP
Dr. Kristof J.P. Jacobs, imec; Dr. David R. Glenn, EuQlid; Dr. Connor Hart, EuQlid; Dr. Cole Meisenhelder, EuQlid; Prof. Ingrid De Wolf, imec, KU Leuven; Dr. Eric Beyne, imec; Mr. Sanjive Agarwala, EuQlid; Dr. Paul van der Heide, imec

6:00 PM

Automated Scanning Acoustic Microscopy for Package‑Level Defect Screening of QFN Devices
Mr. Tal Imanbayev, Tektronix Component Solutions; Mr. Ken Vielmette, Tektronix Components Solution; Ms. Rachael M. Gitnes, M.S., Tektronix Component Solutions; Dr. Shwetha Jakkidi, Sonix Inc

6:20 PM

Solving the Warpage Challenge: Automated Digital De warping for Precise 3D Trace Mapping
Mr. Jose A Perez Vacalla, Intel Corporation; Mr. Scott Eckley, Comet Technologies Canada Inc; Vineeth Bastin, Comet Technologies USA inc; Luke Hunter, Comet Technologies USA inc; Zixiong Cao, Comet Technologies Canada Inc; Mr. Hubert Taieb, Comet Technologies Canada Inc

6:40 PM

Low-Temperature CVD Oxide Deposition for Photoresist Protection
Ms. Ching-Shan Sung, Micron; Dr. Yung Sung Yen, Micron; Ms. Yuan Cheng Tang, Micron; Dr. Ashok Ranjan, Micron Technology; Ms. Bi Jen Chen, Micron

7:00 PM

Planar deprocessing of upper packaging layers in a logic chip using a plasma focused ion beam (PFIB) oxygen source and XeF2 gas assist
Samartha Channagiri Ajit, ThermoFisher Scientific; Han Insub, Samsung Electronics; Mrs. Hayoung Choi, Thermo Fisher Scientific; Mr. Inchang choi, Thermo Fisher Scientific; Kang Christopher H., ThermoFisher Scientific; Azin Akbari, ThermoFisher Scientific

7:20 PM

DRAM Capacitor-Redistribution Layer Overlay Measurement Using Image Processing with Dimple-Grinder Sample Preparation
Dr. Jian-shing Luo, Micron Technology Taiwan; Dr. Ashok Ranjan, Micron Technology

7:40 PM

Backside Delayering of Integrated Circuits for Digital Forensic Analysis: Challenges and Optimization
Mr. Tibbe van der Biezen, Netherlands Forensic Institution; Dr. Aya Fukami, Netherlands Forensic Institution; Mr. Kees Schot, Netherlands Forensic Institution; Dr. Aurelija Mockute, Swedish National Forensic Centre; Mr. Thomas Lindström, Swedish National Forensic Centre; Mr. Björn Ärleskog, Swedish National Forensic Centre

8:00 PM

Automated Workflow for High-Precision Delayering and Failure Analysis in 7nm Programmable Logic
Mr. Lay Lay Goh, Altera Corporation; Ms. Nga Tran, Altera Corporation; Dr. Jateen Gandhi, Thermo Fisher Scientific; Mr. Sailesh C. Suthar, Altera Corporation

8:20 PM

TESCAN FemtoChisel: High-Throughput Laser Sample Preparation and Device De-processing with LPL and Intelligent Multigas Processing, Reserving FIB for Final High-Resolution Steps
Mohammad Taghi Mohammadi Anaei, UConn; Dr. Nicholas May, Tescan, University of Connecticut, REFINE Lab; Matthew Maniscalco, UConn; Dr. Hongbin Choi, Tescan and UConn; José Rodrigo Tavousi, Tescan; Wesley Roser, UConn; Herve Mace, Tescan; Peyman Ahmadi, Tescan; Dr. Sina Shahbazmohamadi, Tescan; Dr. Pouya Tavousi, Tescan

8:40 PM

Revisiting Decapsulation Mechanisms and Backside Analysis in a Power Switch Device with Highly Cross-Linked Molding Compound
Mrs. Melissa Caseria, Analog Devices Inc; Ms. Claide Fenomeno, Analog Devices Inc; Ms. Lovelynn Rusia, Analog Devices Inc

9:00 PM

Laser Scanning Optical PhotoThermal InfraRed (O-PTIR) Microscopy Accelerates Microelectronics Contaminants Identification and Chemical Imaging
Dr. Eoghan Dillon, Photothermal Spectroscopy Corp.; Dr. Michael K. Lo, PhD, Photothermal Spectroscopy Corp.; Dr. Mustafa Kansiz, PhD, Photothermal Spectroscopy Corp.; Dr. Ting Yan, Photothermal Spectroscopy Corp.; Mr. Jay Anderson, Photothermal Spectroscopy Corp.

9:20 PM

Enabling Efficient Strain Analysis of Advanced Nodes with STEM Nanobeam Diffraction Enhanced by Beam Precession at Sub-2nm Spatial Resolution
Dr. Daniel Nemecek, TESCAN Group; Dr. Brendan P. Clarke, TESCAN Group; Mr. Nihtin Iyappan, TESCAN Group; Ms. Alena Suidova, TESCAN Group; Mr. Martin Bolcek, TESCAN Group; Mr. Lukáš Hladík, TESCAN Group; Dr. Paola Favia, imec; Dr. Eva Grieten, imec; Dr. Roger Loo, imec

9:40 PM

Studies of Galvanic Corrosion on Al Bondpads in Wafer Fabrication and Assembly Processes
Dr. Younan Hua, WinTech Nano-Technology Services Pte. Ltd.; Dr. Lois Liao, Wintech-nano; Dr. Lei Zhu, Wintech-Nano; Mr. Yibo Pan, South China University of Technology; Mr. Chuanzeng Wang, Wintech-Nano (Suzhou) Co., Ltd.; Mr. Xiaomin Li, Wintech-Nano (Suzhou) Co.

10:00 PM

Automated High‑Resolution SIMS Nanoanalytics for Advanced Semiconductor Failure Analysis: Overcoming EDS Resolution and Sensitivity Limits
Dr. Peter Gnauck, Raith GmbH; Mr. Torsten Richter, Raith GmbH; Dr. Alexander Ost, Raith GmbH

10:20 PM

Low-Energy X-ray Microanalysis: Mitigating Pathological EDS Peak Overlaps Below 500eV - Carbon on Silver as a Model System
Dr. Bryan Tracy, PhD, ibss Group Inc.

10:40 PM

Failure Model Identification of GOI Failure in Wafer Fabrication
Dr. Younan Hua, WinTech Nano-Technology Services Pte. Ltd.

11:00 PM

Reducing Time‑to‑Result in Wafer Physical Defect Review via Correlative Light Microscopy Pre‑Targeting and Synchronized Automated SEM Imaging
Anthony Lisi, Carl Zeiss Microscopy LLC; Efrat Moyal, Carl Zeiss Microscopy LLC; Dr. David Giraldo, Carl Zeiss Microscopy LLC; Michael O'Relley, Carl Zeiss Microscopy LLC; Dr. Mansoureh Norouzi Rad, Carl Zeiss Microscopy LLC; Nathaniel Cohan, Carl Zeiss Microscopy LLC

11:20 PM

Accelerating Electron Microscopy Spectroscopy and 4D Imaging with Compressed Sensing
Dr. Daniel Nicholls, SenseAI Vision Ltd; Dr. Alex W. Robinson, SenseAI Vision Ltd; Dr. Jack Wells, SenseAI Vision Ltd; Dr. Cliff Mathisen, Nanoscience Instruments; Dr. Sebastian Kossek, Nanoscience Instruments; Prof. Nigel D. Browning, SenseAI Vision Ltd

11:40 PM

A Backside Functional OBIRCH Analysis Approach for High Precision Defect Localization in Digital Logic Blocks
Ms. Jazel Mae P Demetillo, Analog Devices Inc.

12:00 AM

Thermal Management and Degradation Mechanisms in Heterogeneously Integrated Silicon Photonic Light Sources
Mr. Chin Wei Sher, Hon Hai Research Institute, Foxconn; Mr. Yu Lin Huang, Hon Hai Research Institute, Foxconn; Yu Lin Teng, Hon Hai Research Institute, Foxconn; Jen-Shuo Liao, Hon Hai Research Institute, Foxconn; Mr. Ta Yung Liu, Hon Hai Research Institute, Foxconn; Hao Chung Kuo, Hon Hai Research Institute, Foxconn; Ms. Chiu Pei Ju, Materials Analysis Technology Inc.; Mr. Yu Feng Ko, Materials Analysis Technology Inc.

12:20 AM

Backside Analysis–Driven Root Cause Confirmation of Sample FA Cases with Die Crack Failures
Mrs. Anne Lorraine Angustia, Analog Devices; Ms. Claide Fenomeno, Analog Devices

12:40 AM

Path Finder: Automated Connectivity Analysis for Multi‑Hotspot Failure Localization
Ms. Min Xia, Synopsys; Mr. Han Wen low, Synopsys

1:00 AM

Failure analysis methods to localize defects in data path on 3D Flash memory products
Long Phi, Sandisk Technology; Xiaochen Zhu, Sandisk Technology; Elliott Rill, Sandisk Technologies Inc

1:20 AM

Application of 3D X-ray in Root Cause Investigation of Catastrophic EOS/EIPD
Mr. Kasey W. Adams, Texas Instruments; Dr. A. J. Griffin, Jr., Texas Instruments; Mr. Venkat Kalyanaraman, Texas Instruments; Dr. Anagha Kulkarni, Texas Instruments; Mr. James McElrath, Texas Instruments; Dr. Charles A. Odegard, Texas Instruments

1:40 AM

A Reliable Workflow to Localize Silicon Pipeline Defect in MOSFET by Nanoprobe Analysis and Wright Etch Method
Dr. Zheng Shijun, NXP Semiconductors (Tianjin) Ltd.

2:00 AM

The Practical Data Analysis of Transistor Characterization in Nanoprobing
Dr. Yuyan Wang, Texas Instruments

2:20 AM

Advancing SMIM for industrial semiconductor failure analysis
Dr. Hanaul Noh, Park Systems Inc; Dr. Jason Hsieh, Park Systems Inc; Dr. Brian Choi, Park Systems Inc; Dr. Stefan B. Kaemmer, Park Systems Inc

2:40 AM

ISTFA-2026-Conductive AFM Nanoscale Electrical Pathway Analysis of Device failure
Mr. Khristopherson C. Cajucom, Analog Devices Inc San Jose, California

3:00 AM

Non‑Destructive Metrology of PCBs and Advanced Packages Using 3D X‑ray Microscopy
Mr. Vasanth Somasundaram, Advanced Micro Devices, Inc.; Mr. Arun Karunanithi, Advanced Micro Devices, Inc.; Mr. Michell Espitia, Advanced Micro Devices, Inc.

3:20 AM

Evaluating High Speed Pulsed IV Techniques for Resistive Open Via Isolation in Advanced Technology Nodes
Dr. Shang-Yi Lim, Advanced Micro Devices; Vinod Narang, Advanced Micro Devices (S) Pte Ltd