Poster Session

AI-Driven Super-Resolution Enhancement of SEM Images for Semiconductor Failure Analysis
Dr. Alexey Solovey, NVIDIA Corporation; Jonathon Elliott, NVIDIA Corporation; Chuan Zhang, NVIDIA Corporation; Jane Li, NVIDIA Corporation

Failure Analysis Methodology for STT‑MRAM Bit Cells and Emerging Memories
Mr. Cheng-Piao Lin, MSSCORPS CO.,LTD

A Direct Backside Approach Failure Analysis in High-Layer-Count 3D Flash Memory for High Resistance Failures
Mr. Zhung Ping Ooi, SanDisk Storage Malaysia Sdn. Bhd.; Ms. Bee Chin Loke, SanDisk Storage Malaysia Sdn. Bhd.; Mr. Aik Leng Tan, SanDisk Storage Malaysia Sdn. Bhd.; Mr. Mohd Asyraf Mohd Amir Hamzah, SanDisk Storage Malaysia Sdn. Bhd.; Mr. Chee Peng Lim, SanDisk Storage Malaysia Sdn. Bhd.; Lito De La Rama, Sandisk Technologies, Inc.

Extensive Fault Isolation & Defect Localization of Subsurface Silicon Failures in TVS Devices
Mr. Sherwin Hassan, Semtech Corporation; Mr. Jeffrey S. Javier, Semtech Corporation

OBIRCH Hotspot Detection via MH-to-WL Biasing for NAND-type 3D Flash Memory Hole Defect Isolation
Shengli Chen, SanDisk Information Technology (Shanghai) Co. Ltd.; Alex Su, SanDisk Information Technology (Shanghai) Co. Ltd.; Rita Hou, SanDisk Information Technology (Shanghai) Co. Ltd.

Localization of Gate Oxide Defects in Pool Capacitors in NAND-type 3D Flash memory
Mimi Dang, Sandisk Technologies Inc; Xiaochen Zhu, Sandisk Technologies Inc; Ngo Long, Sandisk Technologies Inc; Phi Long, Sandisk Technologies Inc; Elliott Rill, Sandisk Technologies Inc; Lito De La Rama, Sandisk Technologies Inc

Practical Interpretation of Die Crack Origin in Semiconductor Packages Using Multi-Mode Scanning Acoustic Microscopy with B-Scan and TAMI Analysis
Ms. Esther Lim Kean Poh, Infineon Technology Memory Solutions Malaysia Sdn. Bhd.

Quantum Diamond Microscopy as a Non-Destructive Method for Short Localization in High‑Density 2.5D MIMCAP
Dr. Kristof J.P. Jacobs, imec; Dr. David R. Glenn, EuQlid; Dr. Connor Hart, EuQlid; Dr. Cole Meisenhelder, EuQlid; Prof. Ingrid De Wolf, imec, KU Leuven; Dr. Eric Beyne, imec; Mr. Sanjive Agarwala, EuQlid; Dr. Paul van der Heide, imec

Automated Scanning Acoustic Microscopy for Package‑Level Defect Screening of QFN Devices
Mr. Tal Imanbayev, Tektronix Component Solutions; Mr. Ken Vielmette, Tektronix Components Solution; Ms. Rachael M. Gitnes, M.S., Tektronix Component Solutions; Dr. Shwetha Jakkidi, Sonix Inc

Solving the Warpage Challenge: Automated Digital De warping for Precise 3D Trace Mapping
Mr. Jose A Perez Vacalla, Intel Corporation; Mr. Scott Eckley, Comet Technologies Canada Inc; Vineeth Bastin, Comet Technologies USA inc; Luke Hunter, Comet Technologies USA inc; Zixiong Cao, Comet Technologies Canada Inc; Mr. Hubert Taieb, Comet Technologies Canada Inc

Low-Temperature CVD Oxide Deposition for Photoresist Protection
Ms. Ching-Shan Sung, Micron; Dr. Yung Sung Yen, Micron; Ms. Yuan Cheng Tang, Micron; Dr. Ashok Ranjan, Micron Technology; Ms. Bi Jen Chen, Micron

Planar deprocessing of upper packaging layers in a logic chip using a plasma focused ion beam (PFIB) oxygen source and XeF2 gas assist
Samartha Channagiri Ajit, ThermoFisher Scientific; Han Insub, Samsung Electronics; Mrs. Hayoung Choi, Thermo Fisher Scientific; Mr. Inchang choi, Thermo Fisher Scientific; Kang Christopher H., ThermoFisher Scientific; Azin Akbari, ThermoFisher Scientific

DRAM Capacitor-Redistribution Layer Overlay Measurement Using Image Processing with Dimple-Grinder Sample Preparation
Dr. Jian-shing Luo, Micron Technology Taiwan; Dr. Ashok Ranjan, Micron Technology

Backside Delayering of Integrated Circuits for Digital Forensic Analysis: Challenges and Optimization
Mr. Tibbe van der Biezen, Netherlands Forensic Institution; Dr. Aya Fukami, Netherlands Forensic Institution; Mr. Kees Schot, Netherlands Forensic Institution; Dr. Aurelija Mockute, Swedish National Forensic Centre; Mr. Thomas Lindström, Swedish National Forensic Centre; Mr. Björn Ärleskog, Swedish National Forensic Centre

Automated Workflow for High-Precision Delayering and Failure Analysis in 7nm Programmable Logic
Mr. Lay Lay Goh, Altera Corporation; Ms. Nga Tran, Altera Corporation; Dr. Jateen Gandhi, Thermo Fisher Scientific; Mr. Sailesh C. Suthar, Altera Corporation

High-Throughput Laser Sample Preparation and Device De-processing with LPL and Intelligent Multigas Processing, Reserving FIB for Final High-Resolution Steps
Mohammad Taghi Mohammadi Anaei, UConn; Dr. Nicholas May, Tescan, University of Connecticut, REFINE Lab; Matthew Maniscalco, UConn; Dr. Hongbin Choi, Tescan and UConn; José Rodrigo Tavousi, Tescan; Wesley Roser, UConn; Herve Mace, Tescan; Peyman Ahmadi, Tescan; Dr. Sina Shahbazmohamadi, Tescan; Dr. Pouya Tavousi, Tescan

Revisiting Decapsulation Mechanisms and Backside Analysis in a Power Switch Device with Highly Cross-Linked Molding Compound
Mrs. Melissa Caseria, Analog Devices Inc; Ms. Claide Fenomeno, Analog Devices Inc; Ms. Lovelynn Rusia, Analog Devices Inc

Laser Scanning Optical PhotoThermal InfraRed (O-PTIR) Microscopy Accelerates Microelectronics Contaminants Identification and Chemical Imaging
Dr. Eoghan Dillon, Photothermal Spectroscopy Corp.; Dr. Michael K. Lo, PhD, Photothermal Spectroscopy Corp.; Dr. Mustafa Kansiz, PhD, Photothermal Spectroscopy Corp.; Dr. Ting Yan, Photothermal Spectroscopy Corp.; Mr. Jay Anderson, Photothermal Spectroscopy Corp.

Enabling Efficient Strain Analysis of Advanced Nodes with STEM Nanobeam Diffraction Enhanced by Beam Precession at Sub-2nm Spatial Resolution
Dr. Daniel Nemecek, TESCAN Group; Dr. Brendan P. Clarke, TESCAN Group; Mr. Nihtin Iyappan, TESCAN Group; Ms. Alena Suidova, TESCAN Group; Mr. Martin Bolcek, TESCAN Group; Mr. Lukáš Hladík, TESCAN Group; Dr. Paola Favia, imec; Dr. Eva Grieten, imec; Dr. Roger Loo, imec

Studies of Galvanic Corrosion on Al Bondpads in Wafer Fabrication and Assembly Processes
Dr. Younan Hua, WinTech Nano-Technology Services Pte. Ltd.; Dr. Lois Liao, Wintech-nano; Dr. Lei Zhu, Wintech-Nano; Mr. Yibo Pan, South China University of Technology; Mr. Chuanzeng Wang, Wintech-Nano (Suzhou) Co., Ltd.; Mr. Xiaomin Li, Wintech-Nano (Suzhou) Co.

Automated High‑Resolution SIMS Nanoanalytics for Advanced Semiconductor Failure Analysis: Overcoming EDS Resolution and Sensitivity Limits
Dr. Ulrich Mantz, Raith GmbH; Mr. Torsten Richter, Raith GmbH; Dr. Alexander Ost, Raith GmbH

Low-Energy X-ray Microanalysis: Mitigating Pathological EDS Peak Overlaps Below 500eV - Carbon on Silver as a Model System
Dr. Bryan Tracy, PhD, ibss Group Inc.

Failure Model Identification of GOI Failure in Wafer Fabrication
Dr. Younan Hua, WinTech Nano-Technology Services Pte. Ltd.

Reducing Time‑to‑Result in Wafer Physical Defect Review via Correlative Light Microscopy Pre‑Targeting and Synchronized Automated SEM Imaging
Anthony Lisi, Carl Zeiss Microscopy LLC; Efrat Moyal, Carl Zeiss Microscopy LLC; Dr. David Giraldo, Carl Zeiss Microscopy LLC; Michael O'Relley, Carl Zeiss Microscopy LLC; Dr. Mansoureh Norouzi Rad, Carl Zeiss Microscopy LLC; Nathaniel Cohan, Carl Zeiss Microscopy LLC

Accelerating Electron Microscopy Spectroscopy and 4D Imaging with Compressed Sensing
Dr. Daniel Nicholls, SenseAI Vision Ltd; Dr. Alex W. Robinson, SenseAI Vision Ltd; Dr. Jack Wells, SenseAI Vision Ltd; Dr. Cliff Mathisen, Nanoscience Instruments; Dr. Sebastian Kossek, Nanoscience Instruments; Prof. Nigel D. Browning, SenseAI Vision Ltd

A Backside Functional OBIRCH Analysis Approach for High Precision Defect Localization in Digital Logic Blocks
Ms. Jazel Mae P Demetillo, Analog Devices Inc.

Thermal Management and Degradation Mechanisms in Heterogeneously Integrated Silicon Photonic Light Sources
Mr. Chin Wei Sher, Hon Hai Research Institute, Foxconn; Mr. Yu Lin Huang, Hon Hai Research Institute, Foxconn; Yu Lin Teng, Hon Hai Research Institute, Foxconn; Jen-Shuo Liao, Hon Hai Research Institute, Foxconn; Mr. Ta Yung Liu, Hon Hai Research Institute, Foxconn; Hao Chung Kuo, Hon Hai Research Institute, Foxconn; Ms. Chiu Pei Ju, Materials Analysis Technology Inc.; Mr. Yu Feng Ko, Materials Analysis Technology Inc.

Backside Analysis–Driven Root Cause Confirmation of Sample FA Cases with Die Crack Failures
Mrs. Anne Lorraine Angustia, Analog Devices; Ms. Claide Fenomeno, Analog Devices

Path Finder: Automated Connectivity Analysis for Multi‑Hotspot Failure Localization
Ms. Min Xia, Synopsys; Mr. Han Wen low, Synopsys

Failure analysis methods to localize defects in data path on 3D Flash memory products
Long Phi, Sandisk Technology; Xiaochen Zhu, Sandisk Technology; Elliott Rill, Sandisk Technologies Inc

Application of 3D X-ray in Root Cause Investigation of Catastrophic EOS/EIPD
Mr. Kasey W. Adams, Texas Instruments; Dr. A. J. Griffin, Jr., Texas Instruments; Mr. Venkat Kalyanaraman, Texas Instruments; Dr. Anagha Kulkarni, Texas Instruments; Mr. James McElrath, Texas Instruments; Dr. Charles A. Odegard, Texas Instruments

A Reliable Workflow to Localize Silicon Pipeline Defect in MOSFET by Nanoprobe Analysis and Wright Etch Method
Dr. Zheng Shijun, NXP Semiconductors (Tianjin) Ltd.

The Practical Data Analysis of Transistor Characterization in Nanoprobing
Dr. Yuyan Wang, Texas Instruments

Advancing SMIM for industrial semiconductor failure analysis
Dr. Hanaul Noh, Park Systems Inc; Dr. Jason Hsieh, Park Systems Inc; Dr. Brian Choi, Park Systems Inc; Dr. Stefan B. Kaemmer, Park Systems Inc

ISTFA-2026-Conductive AFM Nanoscale Electrical Pathway Analysis of Device failure
Mr. Khristopherson C. Cajucom, Analog Devices Inc San Jose, California

Non‑Destructive Metrology of PCBs and Advanced Packages Using 3D X‑ray Microscopy
Mr. Vasanth Somasundaram, Advanced Micro Devices, Inc.; Mr. Arun Karunanithi, Advanced Micro Devices, Inc.; Mr. Michell Espitia, Advanced Micro Devices, Inc.

Comprehensive TIM Coverage Analysis on Lidded Flip Chip Package Using SAM and Digital Microscopy
Mr. Daniel Nuez, AMD; Zyzi Ramos, PVATEPLA

Closing Test Coverage Gaps in High-Volume Semiconductor Manufacturing: A Debug Methodology Leveraging Failure Analysis
Ms. Shen Shen Lee, Mediatek; Mr. Lay Lay Goh, Altera Corporation; Mr. Jiajun Wu, Altera Corporation