Recrystallization Mechanisms of Ball Grid Array SAC Solder Joint under Thermal Cycling observed with Electron Backscattered Diffraction

Thursday, October 8, 2026: 8:40 AM
Lara Barros Reboucas , NXP Semiconductors, Nijmegen, Gelderland, Netherlands
Eleni Tsepi , NXP Semiconductors, Nijmegen, Gelderland, Netherlands
Sander Wagemans , NXP Semiconductors, Nijmegen, Gelderland, Netherlands
Varun Thukral , NXP Semiconductors, Nijmegen, Gelderland, Netherlands
Pieter Gommers , NXP Semiconductors, Nijmegen, Gelderland, Netherlands
Rik Otte , NXP Semiconductors, Nijmegen, Gelderland, Netherlands
Patrick Rostam-khani , NXP Semiconductors, Nijmegen, Gelderland, Netherlands

See more of: Microscopy Analysis and Material Characterization I
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