Recrystallization Mechanisms of Ball Grid Array SAC Solder Joint under Thermal Cycling observed with Electron Backscattered Diffraction

Thursday, October 8, 2026: 8:40 AM
206 A-B (Henry B. González Convention Center)
Lara Barros Reboucas , NXP Semiconductors, Nijmegen, Gelderland, Netherlands
Eleni Tsepi , NXP Semiconductors, Nijmegen, Gelderland, Netherlands
Sander Wagemans , NXP Semiconductors, Nijmegen, Gelderland, Netherlands
Varun Thukral , NXP Semiconductors, Nijmegen, Gelderland, Netherlands
Pieter Gommers , NXP Semiconductors, Nijmegen, Gelderland, Netherlands
Rik Otte , NXP Semiconductors, Nijmegen, Gelderland, Netherlands
Patrick Rostam-khani , NXP Semiconductors, Nijmegen, Gelderland, Netherlands

See more of: Microscopy Analysis and Material Characterization I
See more of: Technical Program