Microscopy Analysis and Material Characterization I

Thursday, October 8, 2026: 8:00 AM-10:00 AM
Dr. Cecile S. Bonifacio, EA Fischione Instruments and Mr. Tom Schamp, Self
8:00 AM
Edge Detection for Automated Layer Thickness and Interface thickness Measurements of Transmission Electron Microscopy Images of Epitaxial AlxGa1-xN Multilayer Structures
Dr. Zachary R Lingley, Infineon Technologies Austria AG; Dr. Aidan Arthur Taylor, Infineon Technologies Austria AG; Inaki Lujambio, KAI Gmbh; Dr. Guillaume Gomme, Infineon Technologies Austria AG
8:20 AM
Imaging Dopant Interfaces in 5 nm-node finFETs with STEM EBIC
William A Hubbard, PhD, NanoElectronic Imaging, Inc.; Dr. Heiko Stegmann, Carl Zeiss Microscopy GmbH; Ms. Hyun Hwa Kim, Carl Zeiss Microscopy; Mr. Greg Johnson, Carl Zeiss Microscopy
8:40 AM
Recrystallization Mechanisms of Ball Grid Array SAC Solder Joint under Thermal Cycling observed with Electron Backscattered Diffraction
Lara Barros Reboucas, NXP Semiconductors; Eleni Tsepi, NXP Semiconductors; Sander Wagemans, NXP Semiconductors; Varun Thukral, NXP Semiconductors; Pieter Gommers, NXP Semiconductors; Rik Otte, NXP Semiconductors; Patrick Rostam-khani, NXP Semiconductors
9:00 AM
A Novel Accurate Thickness Measurement Method Using Specific Structure within a DRAM Sample and Tilt Adjustment
Mr. Hyoung-sic Cho, Thermo Fisher Scientific; Mr. Dong-yeob KIM, Thermo Fisher Scientific; Dr. Christopher H. Kang, Thermo Fisher Scientific; Ms. In-nyeong Choi, Thermo Fisher Scientific; Mr. Woo Jun Kwon, Thermo Fisher Scientific
9:20 AM
Accelerating 3D Semiconductor Chemistry Mapping by Automated TEM Tomography
Dr. Ajinkya Kadu, Raynetics Technologies B.V.; Mr. Mritunjay Prasad, Raynetics Technologies B.V.; Dr. Maadhav Kothari, Raynetics Technologies B.V.; Dr. Naiara Larreina Vicente, Raynetics Technologies B.V.
9:40 AM
Passive Voltage Contrast for Dopant Calibration
Mr. Greg Johnson, Carl Zeiss Microscopy; Dr. Rainer Arnold, Carl Zeiss Microscopy; Ms. Hyun Hwa Kim, Carl Zeiss Microscopy; Dr. Markus Boese, Carl Zeiss Microscopy; Dr. Thomas Schweinboeck, Infineon; Dr. Soeren Hommel, Infineon; Dr. Aidan Arthur Taylor, Infineon Technologies Austria AG
See more of: Technical Program