Accelerating Failure Analysis through Scan Diagnosis and Defect‑Data Correlation for Yield Improvement at Advanced Technology Nodes
Accelerating Failure Analysis through Scan Diagnosis and Defect‑Data Correlation for Yield Improvement at Advanced Technology Nodes
Tuesday, October 6, 2026: 10:30 AM
Summary:
This work demonstrates a methodology for reducing failure analysis (FA) turnaround time through the correlation of scan diagnosis results with defect data, along with the supporting analysis framework. As semiconductor product design complexity continues to increase and device manufacturing processes scale to advanced technology nodes, timely and effective failure analysis becomes increasingly critical for rapid product yield ramp‑up. By integrating scan diagnosis results with defect data correlation, more than an 80% reduction in FA turnaround time was achieved while maintaining valid analysis results at advanced technology nodes. The demonstrated workflow also enhances scan diagnosis resolution and simultaneously supports quality improvement of inline defect inspection. The proposed framework has been validated not only for single‑case failure analysis but also for high‑volume manufacturing trend analysis, and is expected to serve as an effective tool for yield improvement in advanced technology nodes.
This work demonstrates a methodology for reducing failure analysis (FA) turnaround time through the correlation of scan diagnosis results with defect data, along with the supporting analysis framework. As semiconductor product design complexity continues to increase and device manufacturing processes scale to advanced technology nodes, timely and effective failure analysis becomes increasingly critical for rapid product yield ramp‑up. By integrating scan diagnosis results with defect data correlation, more than an 80% reduction in FA turnaround time was achieved while maintaining valid analysis results at advanced technology nodes. The demonstrated workflow also enhances scan diagnosis resolution and simultaneously supports quality improvement of inline defect inspection. The proposed framework has been validated not only for single‑case failure analysis but also for high‑volume manufacturing trend analysis, and is expected to serve as an effective tool for yield improvement in advanced technology nodes.