Design for Analysis, Test and Diagnostics

Tuesday, October 6, 2026: 10:10 AM-11:00 AM
Jayant D'Souza, Siemens and Arpan Bhattacherjee, NVIDIA Corporation
10:10 AM
Analytical Approach for Revealing Latent Intermittent Column Failures Associated with Bit-Line Sense Amplifier Vulnerability in DRAM
Ms. Hyeonjin Park, Samsung Electronics; Dr. Incheol Nam, Samsung Electronics; Dr. Minsoo Kim, Samsung Electronics; Dr. Seungeun Lee, Samsung Electronics; Mr. Gijong Sung, Samsung Electronics; Mr. Dongkyu Lee, Samsung Electronics; Mr. Changsoo Lee, Samsung Electronics; Dr. Younghun Seo, Samsung Electronics; Mr. Heeil Hong, Samsung Electronics
10:30 AM
Accelerating Failure Analysis through Scan Diagnosis and Defect‑Data Correlation for Yield Improvement at Advanced Technology Nodes
Muyun Cho, Samsung Foundry; Youngseok Son, Samsung Foundry; Hyunyul Lim, Samsung Foundry; Jaeseok Park, Samsung Foundry; Youngjun Woo, Synopsys Inc.; Jeongsu Park, Synopsys Inc.
10:50 AM
Study on Characteristic Degradation Induced by Unused Dummy Patterns in Open Bitline DRAM
Mr. Hyunggon KIM, Samsung Electronics; Mr. Seunghun Lee, Samsung Electronics; Mrs. Jingyeong Seol, Samsung Electronics; Mr. Dongguk Han, Samsung Electronics; Mrs. Jinseon Kim, Samsung Electronics; Dr. Minju Shin, Samsung Electronics; Dr. Minsoo Kim, Samsung Electronics; Mr. Gijong Sung, Samsung Electronics; Dr. Incheol Nam, Samsung Electronics; Mr. Changsoo Lee, Samsung Electronics; Mr. Heeil Hong, Samsung Electronics; Dr. Sangjun Hwang, Samsung Electronics
11:10 AM
Determining Optimal FIB Access Points using DFT-guided Simulation Data
Shaleen Acharya, Siemens; Manish Sharma, Siemens; Jayant D'Souza, Siemens; Rudolf Schlangen, nVIDIA Corporation; Arpan Bhattacherjee, NVIDIA Corporation; Ankur Saxena, Nvidia; Jennifer Huening, nVIDIA Corporation; Dr. William Lo, NVIDIA; Renliang Yuan, NVIDIA Corporation; Jane Li, NVIDIA Corporation
11:30 AM
Closing Test Coverage Gaps in High-Volume Semiconductor Manufacturing: A Debug Methodology Leveraging Failure Analysis
Ms. Shen Shen Lee, Mediatek; Mr. Lay Lay Goh, Altera Corporation; Mr. Jiajun Wu, Altera Corporation
See more of: Technical Program