Thermal Management and Degradation Mechanisms in Heterogeneously Integrated Silicon Photonic Light Sources
Thermal Management and Degradation Mechanisms in Heterogeneously Integrated Silicon Photonic Light Sources
Wednesday, October 7, 2026: 12:40 AM
Summary:
Integrated laser and silicon photonics are increasingly important for power consumption reduction, which can also reduce the space configuration. This study investigated the thermal performance and reliability of flip-chip integrated silicon photonic. High-resolution IR imaging recorded operating temperatures of 48.2°C for the driver and 42°C for the laser. Heat primarily accumulates in bump regions due to high current density and Intermetallic Compound (IMC) interface resistance. The missalgnment of the laser and waveguide were investrated by TEM and SEM, and to determine the packaging precision of the flip-chip process.
Integrated laser and silicon photonics are increasingly important for power consumption reduction, which can also reduce the space configuration. This study investigated the thermal performance and reliability of flip-chip integrated silicon photonic. High-resolution IR imaging recorded operating temperatures of 48.2°C for the driver and 42°C for the laser. Heat primarily accumulates in bump regions due to high current density and Intermetallic Compound (IMC) interface resistance. The missalgnment of the laser and waveguide were investrated by TEM and SEM, and to determine the packaging precision of the flip-chip process.