Artifact-Free Strain Mapping of 3D-IC and SiP Interconnects: Implications for Structural Integrity and Reliability Margins

Thursday, October 8, 2026: 11:00 AM
205 (Henry B. González Convention Center)
Dr. Pawel Nowakowski , E.A. Fischione Instruments, Inc., Export, PA
Dr. Richard Wei-Chih Li , E.A. Fischione Instruments, Inc., Export, PA
Mr. Paul Fischione , E.A. Fischione Instruments, Inc., Export, PA

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