System in Package and 3D Devices

Thursday, October 8, 2026: 10:20 AM-12:20 PM
Mr. Neel Leslie, Thermo Fisher Scientific and Mr. Hemachandar Tanukonda Devarajulu, Intel
10:20 AM
Comprehensive Failure Analysis and Mitigation of Glass Core Substrate Defects for Advanced AI Server Packaging
Mr. SATORU KURAMOCHI, Dai Nippon Printing Co. Ltd.,
10:40 AM
Optimizing X-ray laminography for planar semiconductor devices: A CMOS camera sensor case study
Dr. Till Dreier, Excillum AB; Dr. Daniel Nilsson, Excillum AB; Dr. Julius Hållstedt, Excillum AB
11:00 AM
Artifact-Free Strain Mapping of 3D-IC and SiP Interconnects: Implications for Structural Integrity and Reliability Margins
Dr. Pawel Nowakowski, E.A. Fischione Instruments, Inc.; Dr. Richard Wei-Chih Li, E.A. Fischione Instruments, Inc.; Mr. Paul Fischione, E.A. Fischione Instruments, Inc.
11:20 AM
Automated Navigation Framwork for High-Density 3D VNAND using Structural Periodicity-Based Address Mapping and Computer Vision
Ms. Minji Seo, Samsung Electornics; Mr. Donguk Ko, Samsung Electornics; Ms. Sooyoun Lim, Samsung Electornics; Ms. Hyeongki Kim, Samsung Electornics; Mr. Sangmin Han, Samsung Electornics; Mr. Sungho Lee, Samsung Electornics; Mr. Youngjin Cho, Thermo Fisher Scientific; Mr. Inchang choi, Thermo Fisher Scientific; Dr. Christopher H. Kang, Thermo Fisher Scientific
11:40 AM
Comparison of Magnetic Field Imaging and Lock-In Thermography Techniques for a 2.5D Advanced-Package Microelectronics Devices
Pauli Kehayias, MIT Lincoln Laboratory; Francisco Benito, Intel; Micheal Gold, MIT Lincoln Laboratory; Rohan Kapur, MIT Lincoln Laboratory; Matthew Ricci, MIT Lincoln Laboratory; Christopher Thoummaraj, MIT Lincoln Laboratory; Chandu Devarajulu, Intel; Dr. Jennifer Schloss, MIT Lincoln Laboratory; Dr. Danielle Braje, MIT Lincoln Laboratory
12:00 PM
Chip Scale Packaged, Stacked Imaging Sensor Functional Failure Analysis Through Chip Repackaging
Mrs. Na Li, Omnivision technology
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