Non‑Destructive Metrology of PCBs and Advanced Packages Using 3D X‑ray Microscopy
Non‑Destructive Metrology of PCBs and Advanced Packages Using 3D X‑ray Microscopy
Wednesday, October 7, 2026: 6:00 PM
Summary:
As semiconductor products adopt advanced packaging and high speed printed circuit boards (PCBs), critical structures that drive performance and reliability are increasingly buried beneath multiple material layers. Traditional destructive techniques provide high resolution but are irreversible and often applied only after significant iteration. This paper presents two non destructive metrology case studies using 3d x-ray microscopy (3D XRM) to quantify buried structures without physical sectioning. The first case study demonstrates PCB level metrology, where 3D X ray enables trace level measurements within multilayer boards to assess geometry, continuity, and structural integrity in regions inaccessible to surface inspection. The second case study focuses on package level metrology, where 3D X ray is used to measure lid, thermal interface material (TIM), and die geometry, enabling evaluation of assembly uniformity and potential contributors to thermal and mechanical risk. By reconstructing a volumetric dataset from multiple angular projections, 3D X ray enables virtual cross sectioning and layer isolation, eliminating structural overlap inherent to 2D radiography. These case studies illustrate how 3D X ray can be effectively applied as a non destructive metrology tool to guide failure analysis, manufacturing feedback, and targeted destructive follow up only when necessary.
As semiconductor products adopt advanced packaging and high speed printed circuit boards (PCBs), critical structures that drive performance and reliability are increasingly buried beneath multiple material layers. Traditional destructive techniques provide high resolution but are irreversible and often applied only after significant iteration. This paper presents two non destructive metrology case studies using 3d x-ray microscopy (3D XRM) to quantify buried structures without physical sectioning. The first case study demonstrates PCB level metrology, where 3D X ray enables trace level measurements within multilayer boards to assess geometry, continuity, and structural integrity in regions inaccessible to surface inspection. The second case study focuses on package level metrology, where 3D X ray is used to measure lid, thermal interface material (TIM), and die geometry, enabling evaluation of assembly uniformity and potential contributors to thermal and mechanical risk. By reconstructing a volumetric dataset from multiple angular projections, 3D X ray enables virtual cross sectioning and layer isolation, eliminating structural overlap inherent to 2D radiography. These case studies illustrate how 3D X ray can be effectively applied as a non destructive metrology tool to guide failure analysis, manufacturing feedback, and targeted destructive follow up only when necessary.