Comprehensive TIM Coverage Analysis on Lidded Flip Chip Package Using SAM and Digital Microscopy

Wednesday, October 7, 2026: 3:40 AM
Exhibit Hall (Henry B. González Convention Center)
Mr. Daniel Nuez , AMD, San Jose, CA
Zyzi Ramos , PVATEPLA, Westpark, Wettenberg, Germany

Summary:

A new approach for analyzing TIM on lidded Flip-chip package.
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See more of: Technical Program