Comprehensive TIM Coverage Analysis on Lidded Flip Chip Package Using SAM and Digital Microscopy
Comprehensive TIM Coverage Analysis on Lidded Flip Chip Package Using SAM and Digital Microscopy
Wednesday, October 7, 2026
Exhibit Hall (Henry B. González Convention Center)
Summary:
A new approach for analyzing TIM on lidded Flip-chip package.
A new approach for analyzing TIM on lidded Flip-chip package.