Innovative TIM Coverage Analysis on Lidded Flip Chip Package Using SAM and Digital Microscopy

Wednesday, October 7, 2026: 10:00 AM
Mr. Daniel Nuez , AMD, San Jose, CA
Zyzi Ramos , PVATEPLA, Westpark, Wettenberg, Germany

Summary:

A new approach for analyzing TIM on lidded Flip-chip package.
See more of: Package Level Fault Isolation II
See more of: Technical Program