Solving the Warpage Challenge: Automated Digital De warping for Precise 3D Trace Mapping
Solving the Warpage Challenge: Automated Digital De warping for Precise 3D Trace Mapping
Wednesday, October 7, 2026: 7:00 PM
Summary:
Warpage in advanced microelectronic packages introduces geometric distortions in X-ray CT datasets, leading to mixed-layer visualization and limited interpretability that hinders accurate structural analysis. This work proposes a digital de-warping workflow implemented in Dragonfly 3D World that leverages radial basis function (RBF)-based surface fitting, deformation field generation, and volumetric transformation to convert warped datasets into planarized, layer-aligned representations. Applied to flip-chip pin grid array (FCPGA) packages, the method demonstrates improved separation of individual layers and enhanced visibility of critical features such as power rails and interconnects by eliminating cross-layer mixing artifacts. As a result, the approach significantly improves interpretability and serves as an effective preprocessing step for CT-based inspection, enabling more reliable segmentation, feature extraction, and downstream analysis. The study also emphasizes that achieving sufficient voxel resolution is essential to fully realize the benefits of the de-warping process for accurate reconstruction and analysis of complex package structures.
Warpage in advanced microelectronic packages introduces geometric distortions in X-ray CT datasets, leading to mixed-layer visualization and limited interpretability that hinders accurate structural analysis. This work proposes a digital de-warping workflow implemented in Dragonfly 3D World that leverages radial basis function (RBF)-based surface fitting, deformation field generation, and volumetric transformation to convert warped datasets into planarized, layer-aligned representations. Applied to flip-chip pin grid array (FCPGA) packages, the method demonstrates improved separation of individual layers and enhanced visibility of critical features such as power rails and interconnects by eliminating cross-layer mixing artifacts. As a result, the approach significantly improves interpretability and serves as an effective preprocessing step for CT-based inspection, enabling more reliable segmentation, feature extraction, and downstream analysis. The study also emphasizes that achieving sufficient voxel resolution is essential to fully realize the benefits of the de-warping process for accurate reconstruction and analysis of complex package structures.