Backside Analysis–Driven Root Cause Confirmation of Sample FA Cases with Die Crack Failures

Wednesday, October 7, 2026: 1:00 AM
Mrs. Anne Lorraine Angustia , Analog Devices, General Trias, Cavite, Philippines
Ms. Claide Fenomeno , Analog Devices, General Trias, Cavite, Philippines

Summary:

This paper presents several cases of stacked-die crack failure analysis where systematic backside analysis was essential in validating the true root cause and excluding artifacts introduced during failure analysis. It highlights the importance of incorporating backside analysis into an updated Failure Analysis (FA) flow for die crack, enabling clear differentiation between inherent defects and induced damage, and supporting more accurate source identification for effective corrective actions.
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