Selective Die Exposure in Multi-Chip Modules Using Mechanical Milling Technique
Selective Die Exposure in Multi-Chip Modules Using Mechanical Milling Technique
Thursday, October 8, 2026: 8:00 AM
Summary:
The complexity of multi-chip module devices raises challenges in failure analysis. One of them is exposing the integrated circuit dies without damaging the surrounding components. This study aims to develop a decapsulation process to minimize the damage induced by the conventional chemical methods. A controlled mechanical milling approach was implemented to selectively remove the mold material and expose the target areas. Furthermore, curve trace testing indicates no changes in electrical behavior before and after the decapsulation process. These results demonstrate that the proposed mechanical milling technique provides safer and more reliable decapsulation method for the failure analysis of multi-chip module devices.
The complexity of multi-chip module devices raises challenges in failure analysis. One of them is exposing the integrated circuit dies without damaging the surrounding components. This study aims to develop a decapsulation process to minimize the damage induced by the conventional chemical methods. A controlled mechanical milling approach was implemented to selectively remove the mold material and expose the target areas. Furthermore, curve trace testing indicates no changes in electrical behavior before and after the decapsulation process. These results demonstrate that the proposed mechanical milling technique provides safer and more reliable decapsulation method for the failure analysis of multi-chip module devices.