Sample Preparation and Device De-processing

Thursday, October 8, 2026: 8:00 AM-10:20 AM

Dr. Pawel Nowakowski, E.A. Fischione Instruments, Inc. and Mr. Jon Scholl, Battelle Memorial Institute

8:00 AM

Selective Die Exposure in Multi-Chip Modules Using Mechanical Milling Technique
Ms. Michelle S. Prambita, Analog Devices; Mr. Edgardo Q. Bilog, Analog Devices

8:20 AM

Backside Laminate Removal of Wafer-Level Packaging (WLP) Devices Mounted on Board
Mr. John Michael H. Saputil, Analog Devices; Mr. Jude Portes, Analog Devices

8:40 AM

Combination of Aluminum Tape and Sulfuric–Nitric Acid for uDFN Decapsulation with Copper Metallization Preservation
Mr. Ariane M. Malano, Analog Devices; Mr. John Michael H. Saputil, Analog Devices

9:00 AM

Microwave Induced Plasma Etching for Selective Organic and Silicon Deprocessing in Advanced Packaging
Dr. Sungmin Han, Intel Corporation; Dr. Jiaqi Tang, JIACO Instruments; Mr. Mark W McKinnon, JIACO Instruments; Dr. PENG Li, Intel Corporation

9:20 AM

Innovative Decapsulation Methodology for Multi-Stacked Die Devices: A Hybrid Laser and Chemical Approach
Ms. Rona Victoria C. Balabbo, onsemi; Mr. Brian P. Yabut, onsemi; Mr. Mac Hariss H. Masiris, onsemi; Mr. Michael A. Enriquez, onsemi; Mr. Rodleo A. Gonzales, onsemi

9:40 AM

High-Quality Passive Voltage Contrast Imaging Enabled by a Novel Integrated Low-Angle Ion Milling–SEM Delayering System
Mr. Tatsuhito Kimura, JEOL Ltd.; Mr. Yusuke Uetake, JEOL Ltd.; Mr. Hiroyuki Sato, JEOL Ltd.; Mr. Yasuyuki Okano, JEOL Ltd.; Ms. Natsuko Asano, JEOL Ltd.; Dr. Shunsuke Asahina, Tohoku University, JEOL Ltd.

10:00 AM

Adaptive Milling Guided by a 3D Digital Twin for Large-Area Deprocessing of Warped Advanced Packages and BEOL Stacks
Renliang Yuan, NVIDIA Corporation; Elia Halteh, NVIDIA Corporation; Romha Amha, NVIDIA Corporation; Dante Paquin, NVIDIA Corporation; Jonathon Elliott, NVIDIA Corporation; Chuan Zhang, NVIDIA Corporation; Jane Li, NVIDIA Corporation

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