Application of Synchronous Radio-frequency Modulation based Lock-In Infrared Thermography
Application of Synchronous Radio-frequency Modulation based Lock-In Infrared Thermography
Wednesday, October 7, 2026: 9:00 AM
Summary:
As silicon–package interactions become increasingly complex in advanced packages with the AI-driven growth in heterogenous compute, this study expands on novel applications of LIT using RF signal modulation to isolate failures with electrical open & high resistance signatures in 2.5/3D packaging architectures.
As silicon–package interactions become increasingly complex in advanced packages with the AI-driven growth in heterogenous compute, this study expands on novel applications of LIT using RF signal modulation to isolate failures with electrical open & high resistance signatures in 2.5/3D packaging architectures.