Package Level Fault Isolation I

Wednesday, October 7, 2026: 9:00 AM-9:40 AM
205 (Henry B. González Convention Center)
Sylvia Lewis, Sigray Inc and Ms. Susan Li, Marvell Technology
9:00 AM
Application of Synchronous Radio-frequency Modulation based Lock-In Infrared Thermography
Dr. C Shashank Kaira, Intel Corporation; Hemachandar Tanukonda, Intel
9:20 AM
A Lumped-Element Circuit Model for Improved Spatial Localization of Open Defects in RF Lock-in Thermography (RF-LiT)
Lucas Lum, Advanced Micro Devices (Singapore) Pte Ltd; Bernice Zee, Advanced Micro Devices (Singapore) Pte Ltd; Wen Qiu, Advanced Micro Devices (Singapore) Pte Ltd; Kevin Bo Lin Tan, Advanced Micro Devices (Singapore) Pte Ltd; J.M. Chin, Advanced Micro Devices (Singapore) Pte Ltd
9:40 AM
Comparison of Magnetic Field Imaging and Lock-In Thermography Techniques for 2.5D Advanced-Package Microelectronics Devices
Pauli Kehayias, MIT Lincoln Laboratory; Francisco Benito, Intel; Micheal Gold, MIT Lincoln Laboratory; Rohan Kapur, MIT Lincoln Laboratory; Matthew Ricci, MIT Lincoln Laboratory; Christopher Thoummaraj, MIT Lincoln Laboratory; Chandu Devarajulu, Intel; Dr. Jennifer Schloss, MIT Lincoln Laboratory; Dr. Danielle Braje, MIT Lincoln Laboratory
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