Planar deprocessing of upper packaging layers in a logic chip using a plasma focused ion beam (PFIB) oxygen source and XeF2 gas assist

Wednesday, October 7, 2026

Exhibit Hall (Henry B. González Convention Center)

Samartha Channagiri Ajit , ThermoFisher Scientific, Hillsboro, OR

Han Insub , Samsung Electronics, Hwaseong-si, Gyeonggi-do, Korea, Republic of (South)

Mrs. Hayoung Choi , Thermo Fisher Scientific, Yongin-si, Gyeonggi-do, Korea, Republic of (South)

Mr. Inchang choi , Thermo Fisher Scientific, Yongin-si, Gyeonggi-do, Korea, Republic of (South)

Kang Christopher H. , ThermoFisher Scientific, Youngin-si, Korea, Republic of (South)

Azin Akbari , ThermoFisher Scientific, Hillsboro, OR

See more of: Poster Session
See more of: Technical Program