Planar deprocessing of upper packaging layers in a logic chip using a plasma focused ion beam (PFIB) oxygen source and XeF2 gas assist
Wednesday, October 7, 2026: 7:40 PM
Samartha Channagiri Ajit
,
ThermoFisher Scientific, Hillsboro, OR
Han Insub
,
Samsung Electronics, Hwaseong-si, Gyeonggi-do, Korea, Republic of (South)
Mrs. Hayoung Choi
,
Thermo Fisher Scientific, Yongin-si, Gyeonggi-do, Korea, Republic of (South)
Mr. Inchang choi
,
Thermo Fisher Scientific, Yongin-si, Gyeonggi-do, Korea, Republic of (South)
Kang Christopher H.
,
ThermoFisher Scientific, Youngin-si, Korea, Republic of (South)
Azin Akbari
,
ThermoFisher Scientific, Hillsboro, OR
