AI Applications for Failure Analysis II

Tuesday, October 6, 2026: 12:50 PM-2:50 PM
12:50 PM
Deep Learning-Based 2D ROI Alignment for Automated Semiconductor SEM Imaging
Mr. Youngchan Choi, Thermo Fisher Scientific; Mr. Woo Jun Kwon, Thermo Fisher Scientific; Dr. Christopher H. Kang, Thermo Fisher Scientific
1:10 PM
SAM Signal Deconvolution: Extracting Transducer independent Information
Mr. Lorenz Heinemann, Fraunhofer IMWS; Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Mr. Michael Koegel, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems
1:30 PM
Fine-Tuning Large Language Models in RAG Architecture: An Applied Approach for Failure Analysis
Mr. Markus Kofler, Universität Klagenfurt; Dr. Konstantin Schekotihin, Universität Klagenfurt
1:50 PM
ML-Predicted EOTPR Reference Waveforms from CAD with Layout-Aware Correlation for Efficient Fault Isolation in Advanced Packages
Arpan Bhattacherjee, NVIDIA Corporation; Dr. Joy Liao, NVIDIA Corporation
2:10 PM
Data-Efficient Component Segmentation of PCB X-Ray Images with Adaptive Patch Sampling for Trace Segmentation
Ms. Antika Roy, University of Florida; Mr. Shajib Ghosh, University of Florida; Mr. Pratyush Shukla, University of Florida; Mr. Patrick Craig, University of Florida; Dr. Navid Asadizanjani, University of Florida
2:30 PM
Automation in Microwave-Induced Plasma Decapsulation Verification through Machine Learning
S.Y. Sim, Nanyang Technological University; Q. Liu, Nanyang Technological University; Z. Qiu, Nanyang Technological University; Prof. C.L. Gan, Nanyang Technological University
See more of: Technical Program
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