Package Level Fault Isolation II

Wednesday, October 7, 2026: 10:00 AM-11:40 AM
10:00 AM
Innovative TIM Coverage Analysis on Lidded Flip Chip Package Using SAM and Digital Microscopy
Mr. Daniel Nuez, AMD; Zyzi Ramos, PVATEPLA
10:20 AM
3D current reconstruction for Failure Analysis with Quantum Diamond Microscopy
Mr. Simon Wanninger, QuantumDiamonds; Dr. Jincheng Zhang, QuantumDiamonds; Mr. Maximilian Hecker, QuantumDiamonds; Mr. Andreas Welscher, QuantumDiamonds; Mr. Bartu Bisgin, QuantumDiamonds; Mrs. Janica Tibalao, QuantumDiamonds; Dr. Michael Hanke, QuantumDiamonds; Dr. Fleming Bruckmaier, QuantumDiamonds
10:40 AM
Breaking the Sensitivity and Speed Barriers of Quantum Diamond Magnetic Microscopy for Semiconductor Failure Analysis
Dr. Samuel Mondberg, DiaSense ApS; Dr. Luis D. Bonavena, DiaSense ApS; Dr. Teresa K. Pfau, DiaSense ApS; Mr. Bjarne Schümann, DiaSense ApS; Prof. Alexander Huck, DiaSense ApS; Prof. Ulrik L. Andersen, DiaSense ApS; Dr. Christian D. Nielsen, DiaSense ApS; Dr. Marvin Holten, DiaSense ApS; Mr. Gilbert Rikkink, Eurofins MASER; Mr. Thijs Kempers, Eurofins MASER
11:00 AM
A Comparative Evaluation of Rule‑Based and Deep Learning Approaches for SAM Inspection of QFN Packages
Ms. Rachael Gitnes, Tektronix Component Solutions; Mr. Ken Vielmette, Tektronix Components Solution; Mr. Tal Imanbayev, Tektronix Components Solution; Dr. Shwetha Jakkidi, Sonix Inc
See more of: Technical Program
<< Previous Session | Next Session >>