FA Process: Fault Isolation, Mechanisms & Solutions II

Wednesday, October 7, 2026: 10:00 AM-11:40 AM
206 A-B (Henry B. González Convention Center)
10:00 AM
Accelerated Hierarchical Netlist Correlation Between I/O Failures and Emission Sites in Advanced Process Nodes
Arpan Bhattacherjee, NVIDIA Corporation; Mr. Thong Doan, NVIDIA; Dr. Joy Liao, NVIDIA Corporation
10:20 AM
Application of EBIC/EBIRCH in Failure Analysis for 2nm SRAM Failures: Case Studies
Dr. Qianheng Du, IBM; Dr. Jocho Nxumalo, IBM; Ms. Shitong Wu, IBM; Dr. Zhigang Song, IBM; Mr. Michael Iwatake, IBM; Alberto Cestero, IBM; Dr. Yu Zhu, IBM
10:40 AM
Application of fault localization emission techniques to cases of Copper Re-Distribution Layer VIAS delamination
Mr. Emanuele Villa, ST Microelectronics; Mr. Daniele Drera, ST Microelectronics; Dr. Nicola Pessina, ST Microelectronics
11:00 AM
Localizing Fringe Capacitor Shorts in Advanced Nodes Using a VC Guided FIB Rule Out Methodology and PFIB Delayering
Mr. Benjamin Yuen Sum Lo, NXP Semiconductors NV; Mr. Toby Chen, NXP Semiconductor; Mr. Paul Ang, NXP Semiconductor; Mr. Liangyi Chen, NXP Semiconductor; Mr. Andy Hsu, NXP Semiconductors NV; Mr. KE-YING LIN, NXP Semiconductor; Rik Otte, NXP Semiconductors; Mr. Leon van Nimwegen, NXP Semiconductor
See more of: Technical Program
<< Previous Session | Next Session >>