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Session 21: Metrology and Materials Analysis
Location: Meeting Room J1-J2 (San Jose McEnery Convention Center)
(Please check final room assignments on-site).
Session Description: The 2005 ISTFA Metrology and Materials Analysis session will have a major focus on Transmission Electron Microscopy. Three papers will show improvements to standard TEM techniques. These improvements result in more conclusive failure analysis. The session will also have contributions from the fields of in-line voltage contrast and alternate chemical methods for solving IC related problems.

Editors:Mr. Bryan Tracy Spansion, LCC, Sunnyvale, CA
Mr. Ercan Adem Spansion LLC, Sunnyvale, CA
Mr. Roger L. Alvis Multiprobe, Inc., Santa Barbara, CA
Session Chair:Mr. Bryan Tracy Spansion, LCC, Sunnyvale, CA
1:00 PMDevelopment of High Accuracy Automatic Magnification Calibration Function for Scanning Transmission Electron Microscope
1:25 PMMethodology of Optimum-kV BSE application in SEM and summary of characteristic for low energy SEM/EDS/FIB
1:50 PMIn-line High-Resistance Tungsten Plug Defect Monitoring with an Advanced E-Beam System
2:15 PMA Fast and Inexpensive Product Screening Method for R.O.H.S. Compliance
2:40 PMAn Overview of 300 mm SOI Starting Wafer Quality and Its Yield Detractors