35th International Symposium for Testing and Failure Analysis (November 15-19, 2009): Die and Defect Access

Sunday, November 15, 2009: 10:30 AM-4:45 PM

Meeting Room J3 (San Jose McEnery Convention Center)

Session Chair:

Dr. Chad Rue

10:30 AM

Enhanced De-Packaging and Chip Access
Mr. Kendall Scott Wills, Independent Consultant

11:45 AM

Lunch

12:45 PM

Chip Scale Package and its FA Challenges
Ms. Susan Li, Spansion Inc, Sunnyvale

1:45 PM

Flip Chip and Backside Analysis Techniques
Dr. Edward I. Cole, Sandia National laboratories

3:00 PM

Break

3:15 PM

Delayering Techniques
Mr. Kendall Scott Wills, Independent Consultant

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