Package and Physical Analysis Challenges II

Keyes, Ed

Sunday, November 11, 2012: 3:00 PM-5:00 PM

102C (Phoenix Convention Center)

Session Chairs:

Mr. Ed Keyes and Mr. Christopher A. Pawlowicz

3:00 PM

Delayering: Fundamental to Advanced Techniques
Mr. Christopher A. Pawlowicz, UBM Techinsights

4:00 PM

Flip-Chip and Backside Analysis Techniques
Dr. Edward I. Cole Jr., Sandia National Laboratories; DL Barton, Sandia National laboratories; Ms. Karoline Bernhard-Hofer, Infineon

5:00 PM

ESD (and ESDFOS) in Assembly Machines as a Functional and Reliability Risk – F/A, Delimitation Against EOS, Tool Diagnosis and -Remedies
Prof. Peter Jacob, EMPA Duebendorf

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