Reballing+Prepping Micro Devices Less Than 0.5mm Pitch
Reballing+Prepping Micro Devices Less Than 0.5mm Pitch
Tuesday, November 11, 2014: 9:55 AM
310 A (George R. Brown Convention Center )
Summary:
Devices with bumps or solder balls come in from the field for evaluation needing to be "rebumped" or "reballed" prior to initla electrical evaluation. This paper will discuss recent methods for doing this on very fine pitch devices. Older methods do not work on these fine pitched devices.
Devices with bumps or solder balls come in from the field for evaluation needing to be "rebumped" or "reballed" prior to initla electrical evaluation. This paper will discuss recent methods for doing this on very fine pitch devices. Older methods do not work on these fine pitched devices.