Packaging and Assembly Analysis II

Tuesday, November 11, 2014: 9:55 AM-12:00 PM
310 A (George R. Brown Convention Center )
Session Chair:
Dr. Lihong Cao
9:55 AM
Reballing+Prepping Micro Devices Less Than 0.5mm Pitch
Mr. Robert Wettermann, BEST Inc
10:20 AM
A Comprehensive Investigation of the Galvanic Corrosion Induced Ag-Al Bonding Degradation in Microelectronic Packaging Using Argon Ion Milling, SEM, Dual Beam FIB-SEM, STEM and TOF-SIMS
Dr. Yixin Chen, WinTech Nano-Technology Services Pte. Ltd.
10:45 AM
Correlation of Thin Film Measurement Techniques for Device Packaging Processes
Mr. Juergen Walter, Infineon Technologies AG
11:10 AM
Case Studies on Application of 3D Real Time X-ray for Flip Chip C4 Package
Dr. Lihong Cao, Advanced Micro Devices
11:35 AM
Analysis of Two Electrical Failures Caused By Die Attach of Exposed Pad Package
Mr. Jinglong Li, Freescale Semiconductor(China) Limited; Mr. Motohiko Masuda, Freescale Semiconductor(China) Limited; Mr. Yi Che, Freescale Semiconductor(China) Limited; Miao Wu, Freescale Semiconductor(China) Limited
12:00 PM
Lunch
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