Applying Innovative Techniques for Solving FA Challenges of 3D IC Failures Utilizing Conventional Equipment
Applying Innovative Techniques for Solving FA Challenges of 3D IC Failures Utilizing Conventional Equipment
Monday, November 10, 2014: 2:15 PM
310 A (George R. Brown Convention Center )
Summary:
This paper will be discussing the application of innovative techniques for solving 3D IC failures using the conventional FA equipment to achieve a short turn-around time and high success rate.
This paper will be discussing the application of innovative techniques for solving 3D IC failures using the conventional FA equipment to achieve a short turn-around time and high success rate.