Analysis of Two Electrical Failures Caused By Die Attach of Exposed Pad Package
Analysis of Two Electrical Failures Caused By Die Attach of Exposed Pad Package
Tuesday, November 11, 2014: 11:35 AM
310 A (George R. Brown Convention Center )
Summary:
Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by the die attach are not so simple. And it is not proper to analyze by an ordinary analysis flow. Two such failure analysis cases are introduced. Die attach isolation from backside and front side grinding methods are presented in this paper.
Die attach is well known in die bonding process. Its electrical character is simple. But some failures caused by the die attach are not so simple. And it is not proper to analyze by an ordinary analysis flow. Two such failure analysis cases are introduced. Die attach isolation from backside and front side grinding methods are presented in this paper.