A Systematic Method for the Physical Isolation of a Die in a Stacked-Die Configuration
A Systematic Method for the Physical Isolation of a Die in a Stacked-Die Configuration
Tuesday, November 11, 2014: 9:15 AM
310 A (George R. Brown Convention Center )
Summary:
With the increasing prevalence of stacked dies in the semiconductor industry, failure analysts have been facing a novel challenge since conventional destructive physical analysis methods could no longer be directly applied to identify the root cause of failure. This paper will aim to discuss a highly reliable and systematic method for physically isolating a die in a stacked die configuration.
With the increasing prevalence of stacked dies in the semiconductor industry, failure analysts have been facing a novel challenge since conventional destructive physical analysis methods could no longer be directly applied to identify the root cause of failure. This paper will aim to discuss a highly reliable and systematic method for physically isolating a die in a stacked die configuration.