3D Packages II

Tuesday, November 11, 2014: 8:00 AM-9:40 AM

310 A (George R. Brown Convention Center )

Session Chairs:

Mr. Frank Altmann and Dr. Yan Li

8:00 AM

SAM Assisted Contour Milling
Dr. Christian Hollerith, Infineon tech. AG; Mr. Bernd Krueger, Infineon Tech. AG

8:25 AM

Efficient Non-destructive 3D Defect Localization by Lock-in Thermography utilizing Multi Harmonics Analysis
Mr. Falk Naumann, Fraunhofer Institute for Mechanics of Materials; Mr. Rolf Herold, Fraunhofer Institute for Mechanics of Materials; Mr. Frank Altmann, Fraunhofer Institute for Mechanics of Materials

8:50 AM

Advances in FIB-SEM Analysis of TSV and Solder Bumps - Approaching Higher Precision, Throughput and Comprehensiveness
Dr. Tomas Hrncir, TESCAN Brno; Mr. Jiri Dluhos, TESCAN Brno; Mr. Lukas Hladik, TESCAN ORSAY HOLDING; Mrs. Efrat Moyal, LatticeGear; Mrs. Janet Teshima, LatticeGear; Dr. Jaromir Kopecek, Institute of Physics ASCR

9:15 AM

A Systematic Method for the Physical Isolation of a Die in a Stacked-Die Configuration
Ms. Vivian Jang, Texas Instruments; Mr. Ken C. Sias, Texas Instruments

9:40 AM

Break

See more of: Symposium