Laser Focus Depth Adaptation for Decapsulation of Copper Wirebonded Devices

Monday, November 10, 2014: 3:15 PM
310 A (George R. Brown Convention Center )
Ms. H. B. Kor , Nanyang Technological University, Singapore, Singapore
Dr. Qing Liu , Nanyang Technological University, Singapore, Singapore
Ms. Y. W. Siah , Nanyang Technological University, Singapore, Singapore
Prof. Chee Lip Gan , Nanyang Technological University, Singapore, Singapore

See more of: Packaging and Assembly Analysis I
See more of: Symposium